• Leave Your Message
    Products Categories
    Featured Products

    PSPI Monomer

    BAHS 7545-50-8 202.jpg
    BAP 1220-78-6 203.jpg
    CHPS 30817-90-4 204.jpg
    OBAP 6423-17-2 201.jpg

      Product Related Information

      PSPI Monomer BAHS CAS 7545-50-8
      01

      Overview

      7 Jan 2019
      PSPI monomer is a specialized compound used in the production of photosensitive polyimide (PSPI). These materials are widely used in advanced electronics and microelectronics applications due to their excellent thermal stability, mechanical properties, and photopatterning capabilities. PSPI is particularly valuable in applications such as passivation layers, dielectric layers and stress buffer coatings in the semiconductor industry.

      Key attributes

      Thermal Stability: PSPI monomer contributes to the high thermal stability of the resulting polyimide film, making it suitable for high temperature applications.
      Mechanical Strength: The monomer provides excellent mechanical properties, including high tensile strength and flexibility.
      Photosensitivity: These monomers enable polyimide to be patterned using photolithography techniques, allowing for precise micromachining.
      Chemical Resistance: PSPI materials exhibit strong chemical resistance, making them durable in a variety of processing environments.
      PSPI Monomer BAP CAS 1220-78-6
      02

      Chemical Information

      7 Jan 2019
      Chemical Name: Varies based on the specific PSPI monomer used.
      Molecular Formula: Varies.
      CAS Number: Specific to the monomer in question.

      Application

      Semiconductor Manufacturing: Used as passivation layer, dielectric layer and stress buffer coating in integrated circuits.
      Flexible Electronics: Due to its excellent mechanical properties, it is used in the production of flexible electronic devices.
      Micro-Electro-Mechanical Systems (MEMS): Used in manufacturing MEMS devices due to their high precision and durability.
      Optoelectronics: used in the production of optoelectronic components, including displays and sensors.
      PSPI Monomer CHPS CAS 30817-90-4
      03

      Processing steps

      7 Jan 2019
      Coating: Dissolve PSPI monomer in a suitable solvent and apply it to the substrate using techniques such as spin coating.
      Soft Bake: Bake the coated substrate to remove excess solvent and improve adhesion.
      Exposure: The PSPI layer is exposed through a photomask to transfer the desired pattern to the material.
      Develop: Immerse the substrate in a developer solution to remove exposed or unexposed areas depending on the type of PSPI used.
      Cure: A final baking or curing step is performed to fully polymerize PSPI, thereby enhancing its thermal and mechanical properties.
      PSPI Monomer OBAP CAS 6423-17-2
      04

      Handling and Security

      7 Jan 2019
      Storage: PSPI monomer should be stored in a cool, dry place, away from direct sunlight and fire sources.
      HANDLING: Appropriate protective equipment such as gloves and safety glasses should be used when handling monomers to avoid skin and eye contact.
      Disposal: Waste materials should be disposed of in accordance with local, regional and national regulations.

      in conclusion

      PSPI monomers are important components in photosensitive polyimide formulations and provide thermal stability, mechanical strength, and photopatterning capabilities. These properties make them invaluable in advanced electronics and microelectronics applications, driving innovation in the semiconductor, flexible electronics, MEMS and optoelectronics industries.

      description2