0102030405
PI Monomer
| BAPB | 13080-85-8 |  |
| CBDA | 4415-87-6 |  |
| CFDA | 107934-68-9 |  |
| DMCBDA | 137820-87-2 |  |
| FDA | 15499-84-0 |  |
| MCTC |  |
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| mTD | 84-67-3 |  |
| ODA | 101-80-4 |  |
| 2,4,6-Trimethyl-m-phenylenediamine | 3102-70-3 |  |
| 2716984-43-7 |  |
01
Dianhydride
7 Jan 2019
Pyromellitic dianhydride (PMDA):
One of the most commonly used dianhydrides.
Provides high thermal stability and mechanical strength.
4,4’-Oxydiphthalic anhydride (ODPA):
Provides good flexibility and thermal stability.
Biphenyltetracarboxylic dianhydride (BPDA):
Known for excellent thermal and mechanical properties.
Hexafluoroisopropylidenediphthalic anhydride (6FDA):
Provides high thermal stability and chemical resistance as well as low dielectric constant.
Diamine
4,4’-Diphenylamine (ODA):
Commonly used diamines that provide good mechanical properties and flexibility.
P-phenylenediamine (PDA):
Provides high thermal stability and mechanical strength.
Benzidine:
Known for high thermal stability and rigidity.
3,3’-Diaminodiphenyl sulfone (DDS):
Provides excellent thermal stability and chemical resistance.
02
Synthesis process
7 Jan 2019
Formation of polyamic acid:
The reaction of dianhydride and diamine in a solvent (such as N-methyl-2-pyrrolidone, NMP) forms a polyamic acid precursor.
Imination:
The polyamic acid is then converted chemically or thermally into polyimide through a process called imidization, which involves the removal of water molecules.
Characteristics affected by singletons:
Thermal Stability: Determined by the rigidity and aromatic content of the monomer.
Mechanical Strength: Affected by molecular structure and cross-linking density.
Chemical Resistance: Affected by the presence of functional groups that resist chemical attack.
Flexibility: Depends on the flexibility of the monomer units and the entire polymer chain.
03
Application
7 Jan 2019
Electronics: High performance flexible circuits, insulating films and substrates.
Aerospace: lightweight, high temperature resistant components.
Automotive: sensors, gaskets and insulation.
Medical Device: Biocompatible and sterilizable components.
Industrial: High temperature process linings and composites.
04
in conclusion
7 Jan 2019
Selecting the appropriate PI monomer is critical to tailoring the properties of polyimide films to meet specific application requirements. By understanding the properties of different dianhydrides and diamines, manufacturers can design polyimide materials with optimal performance for a wide range of high-tech and industrial applications.
PI film, known as polyimide film, is a high-performance film insulating material, made of homophthalic tetracarboxylic acid dianhydride (PMDA) and diaminodiphenyl ether (ODA) in strong polar solvents by polycondensation and cast into a film and then imidization. This material has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, media resistance, can be used for a long time in the temperature range of -269 ° C to 280 ° C, short time can reach 400 ° C high temperature. Polyimide film is divided into thermoplastic polyimide and thermosetting polyimide, of which thermoplastic polyimide includes homobenzene-type polyimide film and biphenyl polyimide film.
04
7 Jan 2019
PI film has a wide range of applications, especially suitable for use as flexible printed circuit board substrates and a variety of high-temperature motor and electrical insulation materials. In addition, PI film is also used in AMOLED flexible screen, FCCL of high-end FPC, high-end QFN package and power battery. With the development of science and technology, the demand for PI film is growing, especially in the fields of aerospace, rail transportation and electronic information, its application is becoming more and more extensive. In order to meet the performance requirements of PI films in different fields, researchers have made some progress in preparing PI films with special functions through special monomers or modifying traditional PI films by adding functional nanofillers.
Polyimide (PI) monomers are the basic materials used in the synthesis of polyimide polymers. These monomers usually consist of dianhydrides and diamines, which undergo polycondensation reactions to form polyimide polymers. The choice of monomers significantly affects the properties of the resulting polyimide film, such as thermal stability, mechanical strength, and chemical resistance.
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