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    Epoxy Resin for Coatings

    Epoxy resin is a thermosetting resin that exhibits excellent comprehensive performance when reacted with a suitable curing agent. Through different synthesis and modification processes, a variety of products with different properties such as low viscosity, flame retardancy, high heat resistance and toughening can be prepared, with a regular epoxy group structure. 

    Various epoxy resin products are widely used in national economic and national defense construction fields including aviation, electrical appliances & electronics, petrochemicals, ships, and construction industries, and can be used with special curing agents to meet diverse industrial application requirements.

      Characteristics

      It is a thermosetting resin that, when reacted with an appropriate curing agent, can simultaneously exhibit excellent properties:

      2. Good electrical insulation
      3. Good heat resistance
      4. Good chemical resistance
      5. Small molecular weight, good processability
      Disadvantage: Poor weather resistance, not suitable for outdoor use
      环氧树脂 分类

      Product TYPE

      液体应用 (2)
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      Liquid Epoxy Resin (BPA Type​)​

      Product description
      A general-purpose basic resin polymerized by bisphenol A (BPA) and epichlorohydrin (ECH) in different proportions, with an excellent epoxy group structure.
      Available in multiple specifications such as low viscosity standard grade, electronic grade, and semi-solid type, with strict control of hydrolyzable chlorine content. 
      It is the foundational epoxy resin type for various mainstream application scenarios.
      Application Examples
      Wind power blades
      Epoxy resin floor
      Heavy electrical insulation-transformers
      Product Name Epoxy Equivalent (g/eq) Hydrolyzable Chlorine (ppm) Viscosity (cps/25℃) Color (G) Description
      AF-L127 180-184 0-600 9000-11000 1.0max Low viscosity standard resin
      AF-L127E 180-184 0-300 9000-11000 1.0max Low viscosity standard electronic grade resin
      AF-L127H 182-186 0-300 10000-12000 1.0max Low viscosity standard electronic grade resin
      AF-L128 184-190 0-600 12000-15000 1.0max General-purpose standard resin
      AF-L128E 184-190 0-300 12000-15000 1.0max Electronic grade standard resin
      AF-L128S 205-225 18000-22000 19000-24000 1.0max Low crystallization resin, suitable for civil engineering, coatings, adhesive applications
      AF-L134 230-270 P-U* - 1.0max Semi-solid type, suitable for adhesive and base plate applications
      AF-L144 210-220 0-600 10w-30w 1.0max Same as domestic E44 resin, suitable for civil engineering, coatings, adhesive applications
      *Gel viscosity measurement method (70% solid content in butyldiglycol solution)
      固体应用 (1)
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      Solid Epoxy Resin
      (BPA TYPE)

      Product description
      Specifically high fluidity solid epoxy resin, featured with high epoxy equivalent and controllable ICI viscosity, excellent fluidity and film-forming properties. 
      Mainly developed for powder coating scenarios, also applicable to coil steel coatings and can coatings, with graded specifications for different coating process requirements.
      Application Examples
      Can coatings
      Powder coatings
      Coil steel coatings
      Product Name Epoxy Equivalent (g/eq) Softening Point (℃) Color (G) Description
      AF-S301 450-500 58-72 1.0max For coatings
      AF-S302 620-650 75-85 1.0max For insulating coatings
      AF-S303L 740-770 86-94 1.0max For powder coatings
      AF-S304 900-1000 95-115 1.0max For powder coatings
      Product Name Epoxy Equivalent (g/eq) ICI Viscosity (cps/150℃) Softening Point (℃) Color (G) Description
      AF-S901 460-500 450-600 65-75 1.0max For coatings
      AF-S902 600-750 1000-2500 80-90 1.0max For coatings
      AF-S903 700-750 3000-5000 90-100 1.0max For powder coatings
      AF-S904 780-850 4500-8000 95-105 1.0max For powder coatings epoxy polyester
      AF-S905 930-960 - 100-110 1.0max For powder coatings
      AF-S907 1500-1800 Dissolution viscosity X-Z2 120-130 1.0max For can coatings
      AF-S909 1800-2400 Dissolution viscosity Z3-Z5 135-150 1.0max For can coatings coil coatings
      Product Name* Epoxy Equivalent (g/eq) ICI Viscosity (cps/150℃) Softening Point (℃) Description
      AF-S601 510-570 Dissolution viscosity G-I 75-85 For coatings
      AF-S602 620-650 600-1800 80-90 For powder coatings
      AF-S603 730-760 1500-3500 85-95 For powder coatings
      AF-S604 800-840 2600-6000 90-100 For powder coatings
      AF-S605 900-930 3500-5500 95-105 For powder coatings
      AF-S607 1700-1900 Dissolution viscosity Y-Z 120-135 For can coatings, pipeline and steel bar powder coatings
      AF-S609 2100-3500 Ford#4 cup 20-50s 125-150 For can coatings, pipeline and steel bar powder coatings
      * High fluidity solid epoxy resin
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      BPF Type Epoxy Resin

      Product description
      Compared with BPA type epoxy resin, BPF type epoxy resin is characterized by low viscosity,which is suitable for solvent-free coatings, adhesives,etc. 
      At the same time, it can improveflexibility and adhesion, and is suitable for applications in civil engineering, construction,electrical insulation materials, etc.
      Application Examples
      Civil engineering
      Construction
      Electrical insulation materials
      Product Name Epoxy Equivalent (g/eq) Viscosity (cps/25℃) Color (G) Description
      AF-F170 160-180 2000-5000 1.0max Standard BPF type epoxy resin
      溶剂应用 (2)
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      Solvent-based Epoxy Resin

      Product description
      Epoxy resin products compounded with xylene solvent, with adjustable solid content (74%-86%) and viscosity parameters.
      The product system is designed for solvent-based formulation requirements, with different epoxy equivalent specifications to match diverse coating and adhesive application needs.
      Application Examples
      Marine paint, container paint
      Marine repair paint
      Product Name Epoxy Equivalent (g/eq) Viscosity (cps/25℃) Solid content (%) Description
      AF-S134X85 230-270 2000-5000 84-86 Contains 15% xylene
      AF-S136X80 300-320 3000-7000 79-81 Contains 20% xylene
      AF-S301X75 470-500 6000-14000 74-76 Contains 25% xylene
      AF-S901X75 460-485 8000-15000 74-76 Contains 25% xylene
      AF-S902X75 610-640 22000-50000 74-76 Contains 25% xylene
      阻燃环氧树脂 (1)
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      flame retardant epoxy resin
      - bromine series

      Product description
      Contains bromine (flame retardant element), divided into high bromine type (46-50% bromine content) and low bromine type (18-21% bromine content) by synthesis process. 
      It retains the excellent physical and electrical properties of BPA-ECH type resin while achieving inherent flame retardancy; partial variants have UV shielding property and high Tg value.
      Mainly used in printed circuit boards, copper clad laminates and electronic encapsulation materials.
      Application Examples
      Copper clad laminates
      Circuit boards
      Computers
      Phone
      Product Name Epoxy Equivalent (g/eq) Softening Point (℃) Color (G) Bromine Content (%) Description
      AF-B400 380-410 65-75 0-1.0 46-50 High bromine content epoxy resin
      AF-B400A60 380-410 Solid content 59-61% 0-1.0 46-50 High bromine content epoxy resin
      Product Name Epoxy Equivalent (g/eq) Viscosity (cps/25℃) Solid Content (%) Bromine Content (%) Description
      AF-B450A80 415-445 800-1800 80±1 18-21 Acetone solvent type, white glue with Tg 140℃
      AF-B454A80 425-455 1000-2600 80±1 18-21 Acetone solvent type, with UV light shielding property, suitable for copper clad laminates
      酚醛环氧树脂 (3)
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      PHENOLIC EPOXY RESIN

      Product description
      Including phenol type phenolic epoxy resin and o-cresol type phenolic epoxy resin:
      1. Phenol type: Low viscosity, high crosslinking density (molecular functionality up to about 3.6), with better heat resistance, mechanical and chemical resistance;
      2. o-cresol type: Replaces phenol with o-cresol, has better synthetic stereoselectivity and forms long-chain linear structure polymers.
      Applied to carbon fiber composites, IC chip encapsulant and high-performance substrates.
      Application Examples
      Encapsulant -  IC chip packaging
      Carbon fiber composites -  bicycles/sports equipment/aerospace equipment
      Product Name Epoxy Equivalent (g/eq) Hydrolyzable Chlorine (ppm) ICI Viscosity (cps/70℃) Color (G) Description
      AF-P631 168-178 0-500 1100-1700 1.0max Low viscosity phenol type phenolic epoxy resin
      AF-P638 170-185 0-500 3000-4500 1.0max Phenol type phenolic epoxy resin
      Product Name Epoxy Equivalent (g/eq) Softening Point (℃) Color (G) Description
      AF-C702 190-215 65-75 3.0max o-Cresol type phenolic epoxy resin
      AF-C704 200-220 85-95 3.0max o-Cresol type phenolic epoxy resin
      环氧树脂 (1)
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      DIMERIC ACID MODIFIED EPOXY RESIN

      Product description
      Solvent-based dimer acid modified epoxy resin, this structure can reduce the phase separation between dimer acid and epoxy resin. 
      It modifies epoxy resin to increase resin toughness, impact resistance, thermal shock resistance, etc. 
      Application Examples
      Coatings
      Substrates
      Adhesives
      CFRP
      Product Name Epoxy Equivalent (g/eq) Viscosity (cps/25℃) Solid Content (%) Color (G) Description
      AF-M174X90 245-265 2000-4000 89-90 4.0max Increase resin toughness, impact resistance, thermal shock resistance
      AF-M172 600-700 - - 6.0max Increase resin toughness, impact resistance, thermal shock resistance
      环氧树脂 (2)
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      POLYAMIDE RESIN (CURING AGENT)

      Product description
      Polyamide has room temperature curing properties, good flexibility, low toxicity, high viscosity, excellent water resistance and long pot life.
      Application Examples
      High solid content coatings
      Adhesives
      Sealants formulations
      Product Name Amine Value (mgKOU/g) Viscosity (cps/25℃) Active Hydrogen Equivalent (g/eq) Color (G) Description
      AF-A5022 200-240 50000-70000 (cps/40℃) 165-185 12max Standard high viscosity polyamide, good toughness, good compatibility with epoxy resin
      AF-A5022X70 200-240 550-1100 165-185 9max Solvent-base primer, long pot life
      AF-A640 370-400 8000-15000 100-120 12max Standard high imidazoline content polyamide, uesd in high solid content coatings, adhesives and sealants

      IN CONLUSION

      This epoxy resin series covers 9 core categories including liquid, solid, solvent-based and modified grades, with excellent mechanical, insulation and chemical resistance properties. It features strong compatibility and stable curing performance, widely serving electronics, coatings, composites and construction industries, acting as a high-quality basic material to meet diverse industrial manufacturing needs.

      Choose our epoxy resin to meet your application needs in industrial production, product customization. Contact us for more product details and cooperation support.