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    SPS CAS No.27206-35-5 Electroplating Chemicals

    Product name

    Bis-(Sodium Sulfopropyl) Disulfide (SPS)

    CAS No. 

    27206-35-5

    EINECS  

    248-324-3

    Formula 

    C6H15Na2O6S4

    Molecular Weight

    354.40

    Appearance

    White to off-white solid powder/crystals

    Purity

    ≥98%

    Type

    Acid Copper Plating Brightener

      Product details

      CAS NO
      02

      introduce

      Introducing BIS (sodium sulfopropyl disulfide), a premium compound designed to enhance your electrochemical applications. Our products are manufactured in-house, ensuring the highest quality standards and consistency. SPS is a crucial intermediate in the electroplating process, particularly in the production of electrolytic copper foil. It is an effective copper brightener, refining the crystallization of the copper deposit and significantly increasing current density.

      With our integrated production and trading expertise, we are confident in our ability to provide products that meet your industrial needs.
      CAS No
      02

      Physical and chemical properties

      - Molecular formula: C6H15NaO6S4
      - Appearance: Usually White Powder.
      - Solubility: Highly soluble in water and easily incorporated into electroplating solutions.
      - Stability: Exhibits excellent thermal and chemical stability, ensuring reliable performance under various conditions.
      - Non-toxic: Environmentally friendly and safe for industrial applications.

      These properties make BIS (sodium disulfide) a versatile and effective choice for manufacturers seeking to enhance their electroplating processes.

      advantage

      1. Improves copper plating quality: BIS acts as a brightener in the copper plating solution, refining the crystals of the copper plating layer. This results in a smoother, more uniform surface, which is crucial for high-quality electroplated products.

      2. Increased Current Density: Using BIS enables higher current density during the electroplating process. This means manufacturers can achieve faster plating speeds without compromising coating quality, thereby increasing productivity and efficiency.

      3. Improved Process Control: Adding BIS to the plating tank allows for better control of the plating process. This results in more consistent results, reduces the likelihood of defects, and ensures that the final product meets stringent quality standards.

      4. Cost-Effective Solution: BIS (sodium propyl disulfide sulfonate) improves electroplating process efficiency and enhances end-product quality, providing manufacturers with a cost-effective solution. Reduced defects and faster plating speeds significantly save time and materials.

      5. Versatile: BIS is primarily used in the production of electrolytic copper foil, but can also be used in other electrochemical processes, making it a versatile addition to any manufacturer's chemical toolkit.

      Quality Commitment

      As a manufacturer and trader, we pride ourselves on our commitment to quality and customer satisfaction. Our advanced production facilities and the latest technology enable us to produce BIS (sodium dipropyl disulfide) to the highest standards.

      We perform rigorous quality control testing to ensure that every batch meets our stringent specifications, providing our customers with reliable and effective products.

      in conclusion

      In short, BIS (sodium sulfopropyl disulfide) is an essential compound in the electrochemical industry, particularly in electroplating applications. Its unique physical and chemical properties enhance copper plating quality, increase current density, and improve process control.

      Our commitment to quality and customer satisfaction makes us the ideal partner for your manufacturing needs. Choose BIS (sodium sulfopropyl disulfide) to enhance your electrochemical processes and achieve superior results. Contact us today to learn more about our product and how it can benefit your operations.